Process Engineer - Plasma Etch
L-3 Warrior Systems Infrared Products (IRP) is a leading designer and manufacturer of commercial FPAs that are high-quality, affordable and used in thermal technology products by ground forces and urban tactical teams in support of public safety, homeland security, military and commercial applications.
The Process Engineer (Plasma Etch) develops, characterizes, optimizes, and maintains MEMS and silicon micro-fabrication plasma etch processes required in the manufacture of a State-Of-The-Art MEMS micro-bolometer infrared detector. The incumbent introduces process controls using SPC, DOE, and engineering experimentation to improve the stability and performance of wafer fabrication processes to reduce defects and improve yields. In addition, this position assists in identifying and comprehending major yield loss factors and supports multi-disciplined project teams to drive sustained process improvements.
Essential Duties and Responsibilities
Develop and maintain plasma etch and ash processes on AMAT, LAM and Gasonics etch tools.
Characterize current 200mm silicon wafer etch processes and techniques. Develop & implement a plan for improvements with an emphasis on:
Reducing etch related defects realized at FAB probe.
Increasing die yield through improved etch recipe creation/modification, material selectivity and uniformity improvements.
Increase die yield through post etch residue stripping and reducing process excursions.
Investigating alternative tool and chemistry options for longer term improvements may require some travel to OEM manufacturing facilities.
Reducing cycle-time and cost of ownership.
Generating documentation for sustaining process capability, tool maintenance and production operations.
Drive individual process improvements by working with the Process Engineering team to develop a plan and strategy for yield improvement.
Successfully lead projects related to yield improvement and other KPI improvements pertaining to wafer surface preps and plasma etch development throughout the entire FEOL process.
Use statistical software (JMP, MiniTAB, or similar) to analyze data; consult with senior engineers on experimental results in order to make decisions about large scale changes.
Lead and/or participate in Task Force Teams to drive to root cause analysis with the ability to analyze data and utilize failure analysis for feedback to process engineers, internal customers, or product owners.
Develop detailed project plans and execute to ensure technical performance, schedule, and cost requirements are met.
Professionally communicate to various levels of the organization (both technical and R&D engineering teams, executive management and process technicians).
Own process and equipment capability, including:
Perform process and equipment capability studies to ensure that key parameters are identified, monitored, and controlled.
Develop and manage complex DOE's to drive to yield enhancement in all plasma etch tools.
Provide timely feedback to the entire engineering team about overall health of etch and ash processes.
All other assignments as required.
Education and Experience
Bachelor's degree is in Chemistry, Chemical Engineering, Materials Science, Physics or other related engineering fields from an accredited university or college; Master's or Ph.D. is preferred.
5-10 years' experience in semiconductor wafer FAB operations with an emphasis on developing and maintaining plasma etch processes.
Knowledge, Skills and Abilities
Proficiency in standard Microsoft business software (Word, Excel, PowerPoint and Outlook).
Skilled in plasma etch, ash and deposition processes.
Experience with high-volume MEMS, Integrated circuit, or semiconductor micro-fabrication.
Knowledge of and experience in Yield enhancement and process development in semiconductor manufacturing is strongly preferred.
Strong relationship building skills at all levels of an organization and the ability to work effectively across functions.
Proven leadership ability including project management and team leadership.
Possess exceptional communication (both oral and written) and listening skills, with a strong orientation to details, and the ability to make accurate, informed decisions.
Demonstrated ability to make effective presentations to large audiences including engineering team and senior management team members.
Must be capable of shifting focus and changing priorities.
Must demonstrate strong core values including: Integrity, Respect, Teamwork, Quality, and Continuous Learning.
Proven success in a fast paced development and manufacturing environment and possess a willingness to take ownership, accept accountability, manage changing priorities and thrive under pressure.
We are proud to be an EEO/AA employer - minorities / females / veterans / individuals with disabilities / sexual orientation / gender identity. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
. Apply now!Estimated Salary: $20 to $28 per hour based on qualifications.
The Process Engineer (Plasma Etch) develops, characterizes, optimizes, and maintains MEMS and silicon micro-fabrication plasma etch processes required in the manufacture of a State-Of-The-Art MEMS micro-bolometer infrared detector. The incumbent introduces process controls using SPC, DOE, and engineering experimentation to improve the stability and performance of wafer fabrication processes to reduce defects and improve yields. In addition, this position assists in identifying and comprehending major yield loss factors and supports multi-disciplined project teams to drive sustained process improvements.
Essential Duties and Responsibilities
Develop and maintain plasma etch and ash processes on AMAT, LAM and Gasonics etch tools.
Characterize current 200mm silicon wafer etch processes and techniques. Develop & implement a plan for improvements with an emphasis on:
Reducing etch related defects realized at FAB probe.
Increasing die yield through improved etch recipe creation/modification, material selectivity and uniformity improvements.
Increase die yield through post etch residue stripping and reducing process excursions.
Investigating alternative tool and chemistry options for longer term improvements may require some travel to OEM manufacturing facilities.
Reducing cycle-time and cost of ownership.
Generating documentation for sustaining process capability, tool maintenance and production operations.
Drive individual process improvements by working with the Process Engineering team to develop a plan and strategy for yield improvement.
Successfully lead projects related to yield improvement and other KPI improvements pertaining to wafer surface preps and plasma etch development throughout the entire FEOL process.
Use statistical software (JMP, MiniTAB, or similar) to analyze data; consult with senior engineers on experimental results in order to make decisions about large scale changes.
Lead and/or participate in Task Force Teams to drive to root cause analysis with the ability to analyze data and utilize failure analysis for feedback to process engineers, internal customers, or product owners.
Develop detailed project plans and execute to ensure technical performance, schedule, and cost requirements are met.
Professionally communicate to various levels of the organization (both technical and R&D engineering teams, executive management and process technicians).
Own process and equipment capability, including:
Perform process and equipment capability studies to ensure that key parameters are identified, monitored, and controlled.
Develop and manage complex DOE's to drive to yield enhancement in all plasma etch tools.
Provide timely feedback to the entire engineering team about overall health of etch and ash processes.
All other assignments as required.
Education and Experience
Bachelor's degree is in Chemistry, Chemical Engineering, Materials Science, Physics or other related engineering fields from an accredited university or college; Master's or Ph.D. is preferred.
5-10 years' experience in semiconductor wafer FAB operations with an emphasis on developing and maintaining plasma etch processes.
Knowledge, Skills and Abilities
Proficiency in standard Microsoft business software (Word, Excel, PowerPoint and Outlook).
Skilled in plasma etch, ash and deposition processes.
Experience with high-volume MEMS, Integrated circuit, or semiconductor micro-fabrication.
Knowledge of and experience in Yield enhancement and process development in semiconductor manufacturing is strongly preferred.
Strong relationship building skills at all levels of an organization and the ability to work effectively across functions.
Proven leadership ability including project management and team leadership.
Possess exceptional communication (both oral and written) and listening skills, with a strong orientation to details, and the ability to make accurate, informed decisions.
Demonstrated ability to make effective presentations to large audiences including engineering team and senior management team members.
Must be capable of shifting focus and changing priorities.
Must demonstrate strong core values including: Integrity, Respect, Teamwork, Quality, and Continuous Learning.
Proven success in a fast paced development and manufacturing environment and possess a willingness to take ownership, accept accountability, manage changing priorities and thrive under pressure.
We are proud to be an EEO/AA employer - minorities / females / veterans / individuals with disabilities / sexual orientation / gender identity. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
. Apply now!Estimated Salary: $20 to $28 per hour based on qualifications.
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